Vpm2sm Datasheet May 2026

| Parameter | Value | |-----------|-------| | Package | DO-214AA (SMB) | | Body Length | 4.30 – 4.70 mm | | Body Width | 3.55 – 3.95 mm | | Height | 2.15 mm max | | Lead Solder Temperature | 260°C for 10 seconds |

PCB Footprint Recommendation:
Copper pad size should be at least 1.5x the lead width. Use a 2.5mm x 2.5mm pad with a 0.5mm solder mask opening for optimal thermal dissipation. vpm2sm datasheet

Example pseudocode (I2C)

read_device_id();
write_register(SEQ_CONTROL, AUTONOMOUS);
write_register(THRESHOLD_VMON1_LOW, 0x1A); // example values
write_register(DEBOUNCE_MS, 5);
enable_interrupts();

The VPM2SM is designed for "bulletproof" reliability in mission-critical systems. Key protection features include: | Parameter | Value | |-----------|-------| | Package

A defining characteristic of the VPM2SM series is its efficiency, often exceeding 90% at full load. High efficiency reduces thermal stress, allowing the module to achieve high power density (Watts per cubic inch) without active cooling in some configurations. The VPM2SM is designed for "bulletproof" reliability in

In sealed environments, the baseplate must be attached to a heatsink or chassis. Thermal interface material (TIM) with high thermal conductivity (e.g., 1.0 W/m-K or higher) is required between the module and the mounting surface.

Yes. The 350nm-1100nm range covers both red (660nm) and NIR (940nm) wavelengths used in SpO2 sensors. Its high speed makes it suitable for PPG (photoplethysmography).