Ufs 3.1 Pinout

153-ball BGA – ball A1 at corner marking

A1  B1  C1  D1  E1  F1  G1  H1  J1  K1  L1  M1  N1
A2  B2  C2  D2  E2  F2  G2  H2  J2  K2  L2  M2  N2
A3  B3  C3  D3  E3  F3  G3  H3  J3  K3  L3  M3  N3
...
(Key signals placed as in table above)

Tip: Most designs use ball E3=F3 (RX/TX) for Lane 0. Lane 1 (if present) sits on J3/K3 – but UFS 3.1 often uses only single lane for power saving.

UFS 3.1 pinout varies slightly by vendor. Search for the datasheet using:

  • Request: “BGA 153 ball map” + “UFS 3.1 pin assignment” from vendor’s NDA documentation.

    • Because UFS 3.1 datasheets are under NDA for many manufacturers, your best public resources are:

    UFS 3.1 operates at G4 rates (11.6 Gbps). This is in the microwave frequency domain. Standard eMMC routing rules will fail. ufs 3.1 pinout

    One of the greatest frustrations is that vendors (Samsung, Kioxia, Western Digital) rarely publish public datasheets for UFS 3.1 pinouts. You will encounter:

    *Pro Tip: * Use open-source hardware databases (e.g., from Pine64 or Raspberry Pi CM4 carrier boards) or schematics of older flagship phones (Google Pixel 6, OnePlus 9) which often leak detailed UFS pinouts.

    UFS does not expose JTAG on standard pins. Debug requires:

    Subject: [Request] UFS 3.1 Standard Pinout Schematic

    Body: Hi everyone,

    I'm currently working on a trace repair for a mainboard with a UFS 3.1 storage chip. The pads are damaged, and I'm having trouble identifying the specific TX/RX differential pairs under the microscope.

    Does anyone have a generic BGA-153 pinout diagram for UFS 3.1 they could share? Specifically looking to confirm the location of the REF_CLK and Ground pads to map the rest of the circuit.

    Image of the damaged area attached below. 👇

    Thanks in advance!

    #MobileRepair #Schematics #UFS #HelpNeeded 153-ball BGA – ball A1 at corner marking

    In the context of hardware repair and data forensics, the most "helpful feature" of a UFS 3.1 pinout is its support for In-System Programming (ISP)

    . This allows technicians to connect directly to the storage chip's data lanes without removing it from the motherboard, significantly reducing the risk of heat damage to the chip or surrounding components. Forensic Focus Key Helpful Features of UFS 3.1 Pinouts Samsung 512GB UFS 3.1 - Upgrade Guide & Performance 2026

    (Universal Flash Storage) pinouts typically follow the JEDEC JESD220E specification, primarily using package layouts for mobile and embedded devices.

    Unlike older eMMC storage that uses a 4-bit or 8-bit parallel bus, UFS 3.1 utilizes a high-speed serial interface

    based on the MIPI M-PHY physical layer. This reduces the number of required signal pins while enabling full-duplex communication (simultaneous reading and writing). Kioxia Singapore Pte. Ltd. Critical Signal Groups Tip: Most designs use ball E3=F3 (RX/TX) for Lane 0

    The UFS 3.1 interface is defined by a small set of high-performance differential signal pairs and power rails: eMMC vs UFS - Prodigy Technovations

    ⚠️ Important Note: UFS 3.1 uses M-PHY 4.1 (Gear 4) and UniPro 1.8. While the pinout is physically compatible with UFS 2.x, high-speed signals (Rx/Tx) require stricter PCB layout. Always verify with the specific component datasheet (e.g., Samsung, Kioxia, Micron, SK Hynix).