Micron part numbers generally consist of roughly 13 to 18 characters broken down into distinct fields. While configurations can vary slightly by product family (e.g., NAND Flash vs. DRAM), the standard format for DRAM Modules follows this sequence:
[Family] [Density][Depth] [Organization] [Package] [Speed] [Feature/Revision]
Let’s break down the most common example: a standard DDR4 UDIMM.
Decoding a Micron part number allows you to instantly verify if a stick of RAM is compatible with a motherboard or server. The next time you see a label like MT18ASF1G72AZ-2E3, you can break it down:
By mastering these codes, you eliminate the guesswork from hardware maintenance and upgrades.
Micron utilizes a specialized part numbering system that differs between full Marketing Part Numbers (MPN) and abbreviated FBGA Marking Codes
found physically on memory chips. To bridge this gap, Micron provides the FBGA and Component Marking Decoder
tool to convert short codes into complete, searchable part numbers. 1. FBGA Marking Code vs. Full Part Number
Because of physical space constraints on small memory packages, Micron cannot print the entire MPN on the chip. Instead, they use a five-digit alphanumeric code
This code is typically the second five-digit mark on the chip, often found on the middle or bottom row of text. Common Prefixes: : Standard production parts (e.g., D9WFL).
: Often indicates parts used specifically for Crucial brand modules. : Reserved for engineering samples. 2. How to Use the Decoder Tool To identify a specific chip, use the official Micron FBGA Part Marking Decoder Locate the Code: Find the 5-digit string on the physical chip. Enter the code into the "FBGA Code" field on the website. The tool returns the full Marketing Part Number (e.g., MT40A1G8SA-075:E ), which can then be used to find the Product Data Sheet 3. Anatomy of a Micron Part Number A full Micron MPN (like MT40A1G8SA-075:E ) breaks down into specific segments: : Micron Technology. : Product Family (e.g., 40 = DDR4 SDRAM, 41 = DDR3).
: Density and Configuration (e.g., 1Gb capacity with x8 width). : Package Code (FBGA/BGA type). : Speed Grade (Clock rate/MT/s target).
: Operating Temperature (e.g., IT = Industrial, blank = Commercial). micron memory part number decoder
: Die Revision (Designator for specific internal silicon version). 4. Additional Decoder Resources
Micron offers supplemental guides for specific product categories: FBGA and part decoder | Micron Technology Inc.
Use Micron’s official decoder for precise results, but the patterns above will help you quickly identify basic specs.
Would you like help decoding a specific Micron part number you have?
Understanding a Micron memory part number is essential for identifying the exact specifications of RAM or SSD components. Because physical space on a chip is limited, Micron uses shorthand "FBGA codes" (often starting with D9) that require an official decoder to translate into a full part number. Using the Official Decoder Tools
The most reliable way to identify a part is through Micron’s dedicated online tools:
FBGA and Part Marking Decoder: This is the primary tool for translating the 5-digit code found on individual DRAM chips into a full MT part number. You can access it on the Micron FBGA Decoder page.
SPD Part Number Lookup: For full memory modules, you can use the SPD tool to find detailed serial presence-detect data using the module’s marketing part number. Decoding DRAM Component Part Numbers
Micron DRAM part numbers (e.g., MT40A1G8SA-075:E) follow a specific hierarchical nomenclature: Prefix/Code MT Manufacturer Prefix Micron Technology Product Family Identifies the technology generation 40 = DDR4; 41 = DDR3; 60 = DDR5 Voltage Operating voltage of the die A = 1.2V; K = 1.35V; L = 1.2V Density/Width Memory capacity and bus width 1G8 = 1Gb depth x 8-bit width; 256M16 = 256Mb x 16-bit Speed Grade Performance rating -075 = 2666 MT/s; -062E = 3200 MT/s Die Revision Post-colon letter indicating the silicon "step"
:A, :B, :E (later letters often indicate newer, smaller process nodes) Deciphering FBGA (D9) Codes
If you are looking at a bare chip, you will see two lines of text. The FBGA code is typically the second 5-digit string (e.g., D9WFL). D9...: Standard production parts. C9...: Components often used in Crucial branded modules.
Z9...: Typically designates Engineering Samples (ES) not yet meant for mass production. FBGA and part decoder | Micron Technology Inc. Micron part numbers generally consist of roughly 13
Decoding a Micron memory part number reveals critical specs like technology (DDR4/DDR5), density, and speed grade. Because chips are often too small for full part numbers, they use a 5-digit FBGA code (e.g., D9VPP) that you must decode first. 1. Essential Decoding Tools
FBGA & Component Decoder: Enter the 5-digit code found on the physical chip to get the full "MT" part number.
DRAM Cross-Reference Tool: Compare specific Micron part numbers against competitors or find exact technical specs.
SPD Data Lookup: Get detailed timing and configuration data for a full module. 2. Standard Part Number Breakdown (DRAM)
Most Micron DRAM part numbers follow this pattern: MT [Technology] [Configuration] [Package] - [Speed] [Revision]. Common Codes Definition Technology 40 (DDR4), 60 (DDR5), 41 (DDR3) The generation of memory. Configuration 1G8 (8Gb x8), 512M16 (8Gb x16) Depth (density) and data bus width. Voltage A (1.2V), B (1.1V), K (1.35V) Operating voltage requirements. Speed Grade -062E (DDR4-3200), -075 (DDR4-2666) Max frequency and timing (CL-tRCD-tRP). Die Revision :E, :B, :A The specific manufacturing "generation" or "die". 3. Key Suffixes & Markings FBGA and part decoder | Micron Technology Inc.
Micron memory part numbers can feel like trying to solve a puzzle, but once you know the "key," it's actually quite simple. Micron uses a standardized naming convention where each character in the string represents a specific technical attribute of the component. The Basic Structure
A typical Micron part number (MPN) usually follows this flow:
[Brand] [Technology] [Voltage] [Density] [Configuration] [Package] [Speed] [Revision] How to Decode the Key Segments Brand Identifier : Usually starts with (Micron Technology). Technology Type : DDR4 SDRAM : DDR5 SDRAM : Graphics Memory (GDDR) : NAND Flash Operating Voltage : 1.35V (Low Voltage) : This indicates the total capacity (e.g., for 4 Gigabits,
for 16 Gigabits). Remember, this is often in bits, not bytes! Configuration : Tells you the data bus width (e.g., x4, x8, or x16 Speed Grade : Look for the suffix after the package code (e.g., for DDR4-3200). Pro Tools for Quick Decoding
If you have a physical chip and can't find the full part number, look for the 5-digit FBGA code (e.g., D9VRL). FBGA & Component Marking Decoder Micron’s official lookup tool to convert that 5-digit code into a full part number. Part Catalog : Once you have the full MPN, the Micron Part Catalog provides the specific datasheet for that revision. Why Does This Matter? System Compatibility
: Ensuring the voltage and speed match your motherboard’s specs. Procurement
: Finding exact replacements for EOL (End of Life) components. Performance Tuning By mastering these codes, you eliminate the guesswork
: Identifying the specific die revision (e.g., "B-die" vs "E-die") which is crucial for overclocking. Do you have a specific part number 5-digit FBGA code you need help breaking down right now?
This is critical for timing.
For DDR5, you’ll see -40 (DDR5-4000), -48 (DDR5-4800), or -62 (DDR5-6200).
The trailing letter (
E) indicates the specific timing table (CL, tRCD, tRP).
Let us dissect the DRAM example: MT40A1G16RC-062E:B
1. Prefix – The Manufacturer Identifier
The initial “MT” is the universal prefix for Micron Technology. This distinguishes Micron parts from those of Samsung (K4…), SK Hynix (H5…), or other vendors.
2. Product Family and Voltage
The next characters define the DRAM generation and voltage. In “40A,” the “40” indicates DDR4 SDRAM. (For DDR3, this would be “41” or “8K”; for DDR5, newer prefixes like “60B” appear). The “A” denotes the specific version or design family, often linked to voltage—for example, “A” typically signifies 1.2V VDD/VDDQ for DDR4. This field is critical because mixing voltages can destroy components.
3. Density and Organization
“1G16” splits into two parts: density and width. “1G” means 1 gigabit (Gb) of total memory. However, DRAM chips are often organized as “1G x 16,” where “16” indicates the device width in bits (DQ pins). A “16” yields a 16-bit-wide interface. Other common widths: 4, 8, or 32. Multiplying density by width confirms total capacity: 1Gb × 16 = 16Gb per chip? Wait—caution: In Micron’s notation, “1G16” actually means a 16-bit-wide device with a total density of 16 gigabits (because 1G refers to the number of words, and 16 bits per word). More precisely, it is 1G words × 16 bits = 16 Gb. For a designer building a 64-bit DIMM, four such chips would be needed.
4. Package and Ball Configuration
“RC” is a package designator. “R” often stands for a 78-ball BGA (for x16 DDR4), while “C” may specify the ball map or lead-free status. Other letters indicate different ball counts or package types (e.g., “U” for 96-ball BGA). This field ensures physical compatibility with PCB footprints.
5. Speed Grade (The Performance Key)
“-062E” is where timing enthusiasts focus. The “062” indicates the minimum cycle time in nanoseconds (ns)—here, 0.62 ns, which corresponds to a data rate of 1600 MHz (DDR4-3200). For older parts, “-125” meant 1.25 ns = DDR-800. The trailing “E” specifies the CL (CAS latency) and timing table, e.g., CL22 for DDR4-3200. Speed grade mismatches can cause system instability or failure to boot.
6. Revision and Special Flags
The colon and “B” denote the die revision. This is crucial for tracking errata, power changes, or timing improvements. Revision letters are sequential (A, B, C…). Sometimes an “IT” appears before the revision, signifying Industrial Temperature range (-40°C to +95°C) instead of Commercial (0°C to +95°C). An “A” at the end might indicate automotive grade.
It is important to distinguish between the module capacity and the DRAM chip capacity.
| Part Number | Capacity | Type | Speed | Form Factor | |-------------|----------|------|-------|--------------| | MTA18ASF2G72AZ-3G2B1 | 16GB | DDR4 ECC UDIMM | 3200 | 288-pin DIMM | | MTA20ASF1G64HZ-2G6E1 | 8GB | DDR4 Non-ECC SODIMM | 2666 | 260-pin SODIMM | | MTA36ASF4G72PZ-3G2R1 | 32GB | DDR4 Registered ECC | 3200 | 288-pin RDIMM | | MTA18ASF4G72AZ-3G2B1 | 32GB | DDR4 ECC UDIMM | 3200 | 288-pin DIMM |